Printed Circuit Board finishes used to be simple consisting of either HASL (hot air solder leveling) or electrolytic nickel / gold. For years lead based finishes dominated the industry but technology and environmental concerns have altered the landscape for manufacturing printed circuit boards and more importantly the use of lead-free finishes used on circuit boards.
RoHS compliance , which took effect July 1, 2006, has established a new set of regulations requiring circuit board manufacturers to use lead-free finishes. There are a variety of lead-free finishes available today that meet RoHS compliance but it is important to understand the pros and cons of each finishing option and which to choose for your application.
Please select from the list below to learn more about lead free circuit board finishes:
- Organic Solderability Preservative – OSP
- Immersion Silver
- Electroless Nickel Immersion Gold – ENIG
- Hard Gold
- White Tin
- Lead-Free Hot Air Solder Leveling – Lead-Free HASL
- Lead Free Finishes - Comparison Chart
Organic Solderability Preservative (OSP's) lead-free finishes are available in different thicknesses, are inexpensive, provide good surface oxidation, coplanarity and are easy to apply. OSPs are limited in the number of heat cycles and some require a nitrogen environment at time of assembly. OSPs have a poor shelf life, degrade with high temperatures, have poor wettability and are not suited for wire bonding or as a contacting surface.
Electroless Nickel Immersion Gold - ENIG This finish is by far one of the best lead-free finishes available, but does require proficiency, knowledge and experience to properly fabricate printed circuit boards. Because this finish has special requirements Triangle Circuits has created a separate page for more details on ENIG.
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